DM5420J/883 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.200 INCHES NOMINAL IN, body_length: 0.785 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-160-5015, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DM5420J/883

NSN: 5962-00-160-5015
FSC: 5962
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.290 INCHES NOMINAL IN
body_height	0.200 INCHES NOMINAL IN
body_length	0.785 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	QUAD 2 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-00-160-5015

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 40.0 MILLIWATTS

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INCLOSURE MATERIAL: CERAMIC AND GLASS

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

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CASE OUTLINE SOURCE AND DESIGNATOR: T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL

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DESIGN FUNCTION AND QUANTITY: 2 GATE, NAND

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TEST DATA DOCUMENT: 96906-MIL-STD-883B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TIME RATING PER CHACTERISTIC: 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

TECHNICAL CHARACTERISTICS (FLIS)

MAXIMUM POWER DISSIPATION RATING	40.0 MILLIWATTS
INCLOSURE MATERIAL	CERAMIC AND GLASS
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATOR	T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
DESIGN FUNCTION AND QUANTITY	2 GATE, NAND
TEST DATA DOCUMENT	96906-MIL-STD-883B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC	22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 25

486041-8Interchangeable