The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND W/OPEN COLLECTOR AND HIGH VOLTAGE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-038-1010, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND W/OPEN COLLECTOR AND HIGH VOLTAGE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-01-038-1010 |
| FEATURES PROVIDED | LOW POWER AND W/OPEN COLLECTOR |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |