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Technical Data Sheet

DM28C256-200/BB125 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

DM28C256-200/BB125: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.232 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ERASABLE AND PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-349-3396, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
DM28C256-200/BB125
NSN: 5962-01-349-3396
FSC: 5962 — Microcircuits, Electronic
CAGE: 61394 — SEEQ TECHNOLOGY INC (USA)
SPECIFICATIONS
body_width0.610 INCHES MAXIMUM IN
body_height0.232 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
features_providedMONOLITHIC AND ERASABLE AND PROGRAMMABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEEPROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern23 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-349-3396
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN DM28C256-200/BB125 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 23 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.232 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND ERASABLE AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: EEPROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN23 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.610 INCHES MAXIMUM IN
BODY HEIGHT0.232 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND ERASABLE AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEEEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
BODY LENGTH1.490 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 4
5962-8852504XXReference document
Same NSN cross-reference
Reference document — Secondary reference
725005-354Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
X28C256DMB-20C6922Reference document
Same NSN cross-reference
Reference document — Secondary reference
AT28C256-20DM/883Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is DM28C256-200/BB125?
DM28C256-200/BB125 is a MICROCIRCUIT,MEMORY.
What parts can replace DM28C256-200/BB125?
There are 4 known substitutes for DM28C256-200/BB125: 5962-8852504XX, 725005-354, X28C256DMB-20C6922 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for DM28C256-200/BB125?
DM28C256-200/BB125 is cataloged in the U.S. Government catalog under NSN 5962-01-349-3396. This indicates validated use in U.S. government and defense supply chains.
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