DM2764-450: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.232 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, overall_width: 0.620 INCHES MAXIMUM IN, overall_height: 0.432 INCHES MAXIMUM IN, overall_length: 1.490 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-199-2901, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.232 INCHES MAXIMUM IN |
| body_length | 1.490 INCHES MAXIMUM IN |
| overall_width | 0.620 INCHES MAXIMUM IN |
| overall_height | 0.432 INCHES MAXIMUM IN |
| overall_length | 1.490 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND ERASABLE AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-199-2901 |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.625 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.217 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | PROM |
| BODY LENGTH | 1.485 INCHES MAXIMUM IN |