DI30979: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: STEEL OVERALL, alignment_type: RIGID, overall_height: 0.6230 INCHES MINIMUM AND 0.6237 INCHES MAXIMUM IN, surface_finish: GROUND, special_features: RINGS OVERLAP, style_designator: GROOVED RACE SURFACE, BANDED OD. This part is cataloged in the U.S.
Government catalog under NSN 3110-00-277-0406, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL OVERALL |
| alignment_type | RIGID |
| overall_height | 0.6230 INCHES MINIMUM AND 0.6237 INCHES MAXIMUM IN |
| surface_finish | GROUND |
| special_features | RINGS OVERLAP |
| style_designator | GROOVED RACE SURFACE, BANDED OD |
| bore_smallest_diameter | 1.1250 INCHES MINIMUM AND 1.1260 INCHES MAXIMUM IN |
| overall_outside_diameter | 1.9950 INCHES MINIMUM AND 2.0050 INCHES MAXIMUM IN |
| thrust_directional_capability_designation | SINGLE |
| NSN | 3110-00-277-0406 |
| OVERALL HEIGHT | 0.6230 INCHES MINIMUM AND 0.6237 INCHES MAXIMUM IN |
| SURFACE FINISH | GROUND |
| STYLE DESIGNATOR | GROOVED RACE SURFACE, BANDED OD |
| THRUST DIRECTIONAL CAPABILITY DESIGNATION | SINGLE |
| OVERALL OUTSIDE DIAMETER | 1.9950 INCHES MINIMUM AND 2.0050 INCHES MAXIMUM IN |
| BORE SMALLEST DIAMETER | 1.1250 INCHES MINIMUM AND 1.1260 INCHES MAXIMUM IN |
| ALIGNMENT TYPE | RIGID |
| SPECIAL FEATURES | RINGS OVERLAP |
| MATERIAL | STEEL OVERALL |