Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: DH76052-3

DH76052-3 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.390 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.520 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-171-5581, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DH76052-3

NSN: 5962-01-171-5581
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.390 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.520 INCHES MAXIMUM IN
features_provided	BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	82577-932892 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-171-5581

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 715.0 MILLIWATTS

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT

•

BODY WIDTH: 0.390 INCHES MAXIMUM IN

•

BODY LENGTH: 0.520 INCHES MAXIMUM IN

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MAXIMUM POWER DISSIPATION RATING	715.0 MILLIWATTS
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT
BODY WIDTH	0.390 INCHES MAXIMUM IN
BODY LENGTH	0.520 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	18 FLAT LEADS
TEST DATA DOCUMENT	82577-932892 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

19582Interchangeable