POLARIZING KEY,ELECTRICAL CONNEC. Key specifications include body_width: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-157-9899, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| body_height | 0.090 INCHES MAXIMUM IN |
| body_length | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-157-9899 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.090 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 1085.0 MILLIWATTS |
| INCLOSURE MATERIAL | CERAMIC |