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Technical Data Sheet
PartsTable / COMPONENT / DH75703-554
DH75703-554 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-186-9710, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
DH75703-554
NSN: 5962-01-186-9710
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height0.090 INCHES MAXIMUM IN
body_length0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
features_providedPROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
inclosure_configurationFLAT PACK
NSN5962-01-186-9710
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN DH75703-554 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY LENGTH: 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.090 INCHES MAXIMUM IN
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 18 FLAT LEADS
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY LENGTH0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
BODY HEIGHT0.090 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY18 FLAT LEADS
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDEDPROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE AND ELECTROSTATIC SENSITIVE
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
580C5Interchangeable
interchangeable cross-reference
interchangeable
19114Interchangeable
interchangeable cross-reference
interchangeable
P250B5144Interchangeable
interchangeable cross-reference
interchangeable
G350154S2Interchangeable
interchangeable cross-reference
interchangeable
047B3800-75Interchangeable
interchangeable cross-reference
interchangeable
10X381Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is DH75703-554?
DH75703-554 is a MICROCIRCUIT,MEMORY.
What parts can replace DH75703-554?
There are 22 known substitutes for DH75703-554: 580C5, 19114, P250B5144 and 19 more. Substitute compatibility should be verified for your specific system.
What is the NSN for DH75703-554?
DH75703-554 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-186-9710. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
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Last verified: July 2026