DG303AP — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

DG303AP: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 0.640 INCHES MINIMUM AND 0.786 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-112-5678, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DG303AP

NSN: 5962-01-112-5678
NIINs: 011125678, 011680950
FSC: 5962 — Microcircuits, Electronic
CAGE: 17856 — SILICONIX INCORPORATED DIV SILICONIX (USA)

SPECIFICATIONS

body_width	0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
body_length	0.640 INCHES MINIMUM AND 0.786 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	DUAL 3 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
specification/standard_data	81349-MIL-M-38510/116 GOVERNMENT SPECIFICATION
design_function_and_quantity	2 SWITCH, ANALOG
NSN	5962-01-112-5678

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: DUAL 3 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 SWITCH, ANALOG

•

BODY WIDTH: 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	DUAL 3 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 SWITCH, ANALOG
BODY WIDTH	0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	0.640 INCHES MINIMUM AND 0.786 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

3461267Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is DG303AP?

DG303AP is a MICROCIRCUIT,LINEAR.

What parts can replace DG303AP?

There is 1 known substitute for DG303AP: 3461267. Substitute compatibility should be verified for your specific system.

What is the NSN for DG303AP?

DG303AP is cataloged in the U.S. Government catalog under NSN 5962-01-112-5678. This indicates validated use in U.S. government and defense supply chains.

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