PartsTable
Technical Data Sheet
Download PDF

DER157 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

DER157: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.120 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.940 INCHES MAXIMUM IN, overall_diameter: 0.056 INCHES MINIMUM AND 0.094 INCHES MAXIMUM IN, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-172-4357, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
DER157
NSN: 5961-01-172-4357
NIINs: 011724357, 012395852
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 12969 — MICRO USPD INC (USA)
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
overall_length0.120 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
mounting_methodTERMINAL
terminal_length1.000 INCHES MINIMUM AND 1.940 INCHES MAXIMUM IN
overall_diameter0.056 INCHES MINIMUM AND 0.094 INCHES MAXIMUM IN
terminal_type_and_quantity2 UNINSULATED WIRE LEAD
maximum_operating_temp_per_measurement_point175.0 CELSIUS AMBIENT AIR DEGC
NSN5961-01-172-4357
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN DER157 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 CELSIUS AMBIENT AIR DEGC
•
OVERALL DIAMETER: 0.056 INCHES MINIMUM AND 0.094 INCHES MAXIMUM IN
•
TERMINAL LENGTH: 1.000 INCHES MINIMUM AND 1.940 INCHES MAXIMUM IN
•
MOUNTING METHOD: TERMINAL
•
MATERIAL: SILICON SEMICONDUCTOR
•
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
TECHNICAL CHARACTERISTICS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT175.0 CELSIUS AMBIENT AIR DEGC
OVERALL DIAMETER0.056 INCHES MINIMUM AND 0.094 INCHES MAXIMUM IN
TERMINAL LENGTH1.000 INCHES MINIMUM AND 1.940 INCHES MAXIMUM IN
MOUNTING METHODTERMINAL
OVERALL LENGTH0.120 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
MATERIALSILICON SEMICONDUCTOR
MATERIALGLASS ENCLOSURE
TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD
SUBSTITUTES & CROSS-REFERENCES 1
033843-1Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementNo demilitarization required
Ready to buy DER157?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is DER157?
DER157 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace DER157?
There is 1 known substitute for DER157: 033843-1. Substitute compatibility should be verified for your specific system.
What is the NSN for DER157?
DER157 is cataloged in the U.S. Government catalog under NSN 5961-01-172-4357. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — DER157