The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.265 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.100 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5961-00-997-1287, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.265 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.100 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 200.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 150.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 30.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 175.0 CELSIUS AMBIENT AIR DEGC |
| joint_electronic_device_engineering_council/jedec/case_outline_designation | DO-7 |
| NSN | 5961-00-997-1287 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MOUNTING METHOD | TERMINAL |