DAC-HF10/883B: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.800 INCHES MAXIMUM IN, body_height: 0.168 INCHES MAXIMUM IN, body_length: 1.310 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-166-1298, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.800 INCHES MAXIMUM IN |
| body_height | 0.168 INCHES MAXIMUM IN |
| body_length | 1.310 INCHES MAXIMUM IN |
| features_provided | LOW IMPEDANCE AND LASER TRIMMED AND UNIPOLAR AND BIPOLAR AND HIGH SPEED AND HYBRID AND HIGH PERFORMANCE AND HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| hybrid_technology_type | FILM AND MULTICHIP |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-166-1298 |
| HYBRID TECHNOLOGY TYPE | FILM AND MULTICHIP |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, DIGITAL TO ANALOG |
| BODY WIDTH | 0.800 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.168 INCHES MAXIMUM IN |
| CAPITANCE RATING PER CHARACTERISTIC | 15.00 OUTPUT PICOFARADS NOMINAL |
| FEATURES PROVIDED | LOW IMPEDANCE AND LASER TRIMMED AND UNIPOLAR AND BIPOLAR AND HIGH SPEED AND HYBRID AND HIGH PERFORMANCE AND HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |