D5927: SEMICONDUCTOR DEVICE,DIODE.
The various components of a computer system such as the chipset, the graphics card and the hard drive can produce a large amount of heat while operating. This large amount of heat may be harmful for the proper functioning of the system. The heat sinks and the fans are responsible for dissipating this heat and maintaining the safe temperature limits.
The most important factor which determines the selection of Heatsink Assembly is the processor type and its speed. Different processors have different operating temperatures. When selecting replacement heat sink and fan assebmlies for your higher speed processor, please make certain the specifications match orginal system purchase.
The chassis type is also important as it defines the housing of the heat sink assembly and compatibility with the system. In order to buy the right fan and heatsink for your system, we recommend that you use the Service Tag look up feature in the Parts For Your Dell™ tool. This will allow us to iden This part is cataloged in the U.S.
Government catalog under NSN 5961-00-443-8553, indicating validated use in U.S. government and defense logistics supply chains.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.150 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.175 INCHES MAXIMUM IN |
| overall_diameter | 0.065 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE AND BURN IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 313.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| capacitance_rating_in_picofarads | 0.3 MINIMUM AND 0.6 MAXIMUM |
| voltage_rating_in_volts_per_characteristic | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| NSN | 5961-00-443-8553 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| OVERALL DIAMETER | 0.065 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 0.175 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE AND BURN IN |
| CAPACITANCE RATING IN PICOFARADS | 0.3 MINIMUM AND 0.6 MAXIMUM |
| TEST DATA DOCUMENT | 37695-619327 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |