D2147-3: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.360 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.360 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE AND MONOLITHIC, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-078-4877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.360 INCHES MAXIMUM IN |
| body_height | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.360 INCHES NOMINAL IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE AND MONOLITHIC |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 15 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-078-4877 |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| FEATURES PROVIDED | 3-STATE OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |