D2141L-3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

D2141L-3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND LOW POWER, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-147-1936, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

D2141L-3

NSN: 5962-01-147-1936
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
body_length	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND LOW POWER
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
end_item_identification	AN/WLR-6 33472
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-147-1936

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

AM21L41-15DCReference document

Same NSN cross-reference

Reference document — Secondary reference

LM390NReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is D2141L-3?

D2141L-3 is a MICROCIRCUIT,MEMORY.

What parts can replace D2141L-3?

There are 2 known substitutes for D2141L-3: AM21L41-15DC, LM390N. Substitute compatibility should be verified for your specific system.

What is the NSN for D2141L-3?

D2141L-3 is cataloged in the U.S. Government catalog under NSN 5962-01-147-1936. This indicates validated use in U.S. government and defense supply chains.

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