D2125AL: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.896 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 1024, features_provided: LOW POWER AND 3-STATE OUTPUT. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-101-7555, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.896 INCHES MAXIMUM IN |
| bit_quantity | 1024 |
| word_quantity | 1024 |
| features_provided | LOW POWER AND 3-STATE OUTPUT |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| NSN | 5962-01-101-7555 |
| BIT QUANTITY | 1024 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| WORD QUANTITY | 1024 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | LOW POWER AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
No substitute or cross-reference records for this part.