CY7C7130-70LMB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CY7C7130-70LMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN, body_height: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-295-4577, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CY7C7130-70LMB

NSN: 5962-01-295-4577
FSC: 5962 — Microcircuits, Electronic
CAGE: 65786 — INFINEON TECHNOLOGIES AMERICAS CORP. (USA)

SPECIFICATIONS

body_width	0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN
body_height	0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-295-4577

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: RAM

•

CASE OUTLINE SOURCE AND DESIGNATOR: C-6 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN
BODY HEIGHT	0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	C-6 MIL-M-38510
BODY LENGTH	0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

CY7C131-55JISame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

IDT7130LA70L52BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is CY7C7130-70LMB?

CY7C7130-70LMB is a MICROCIRCUIT,MEMORY.

What parts can replace CY7C7130-70LMB?

There are 2 known substitutes for CY7C7130-70LMB: CY7C131-55JI, IDT7130LA70L52B. Substitute compatibility should be verified for your specific system.

What is the NSN for CY7C7130-70LMB?

CY7C7130-70LMB is cataloged in the U.S. Government catalog under NSN 5962-01-295-4577. This indicates validated use in U.S. government and defense supply chains.

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