The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: PROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 28 LEADLESS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-423-0575, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| memory_device_type | PROM |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 28 LEADLESS |
| time_rating_per_chacteristic | 45.00 NANOSECONDS MAXIMUM ACCESS NS |
| part_name_assigned_by_controlling_agency | 2048 X 8 EPROM |
| voltage_rating_and_type_per_characteristic | 7.0 VOLTS NOMINAL POWER SOURCE |
| NSN | 5962-01-423-0575 |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 2048 X 8 EPROM |
| MEMORY DEVICE TYPE | PROM |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS NOMINAL POWER SOURCE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |