CY7C136-55JI — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CY7C136-55JI: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.790 INCHES NOMINAL IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.790 INCHES NOMINAL IN, overall_width: 0.761 INCHES MAXIMUM IN, overall_height: 0.120 INCHES MAXIMUM IN, overall_length: 0.761 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-8871, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CY7C136-55JI

NSN: 5962-01-303-8871
NIINs: 013038871, 014605018
FSC: 5962 — Microcircuits, Electronic
CAGE: 65786 — INFINEON TECHNOLOGIES AMERICAS CORP. (USA)

SPECIFICATIONS

body_width	0.790 INCHES NOMINAL IN
body_height	0.200 INCHES MAXIMUM IN
body_length	0.790 INCHES NOMINAL IN
overall_width	0.761 INCHES MAXIMUM IN
overall_height	0.120 INCHES MAXIMUM IN
overall_length	0.761 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC OR GLASS OR METAL
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-303-8871

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 37 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.761 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.088 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.120 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	37 INPUT
INCLOSURE MATERIAL	CERAMIC OR GLASS OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.761 INCHES MAXIMUM IN
BODY HEIGHT	0.088 INCHES MAXIMUM IN
OVERALL LENGTH	0.761 INCHES MAXIMUM IN
OVERALL WIDTH	0.761 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK

SUBSTITUTES & CROSS-REFERENCES 4

IDT71321SA55L52BReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

CY7C136-55LMBReference document

Same NSN cross-reference

Reference document — Secondary reference

IDT7132LA70L52BReference document

Same NSN cross-reference

Reference document — Secondary reference

IDT7132L70LB52Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is CY7C136-55JI?

CY7C136-55JI is a MICROCIRCUIT,MEMORY.

What parts can replace CY7C136-55JI?

There are 4 known substitutes for CY7C136-55JI: IDT71321SA55L52B, CY7C136-55LMB, IDT7132LA70L52B and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for CY7C136-55JI?

CY7C136-55JI is cataloged in the U.S. Government catalog under NSN 5962-01-303-8871. This indicates validated use in U.S. government and defense supply chains.

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