CY74FCT541ATSOC: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.098 INCHES MINIMUM AND 0.105 INCHES MAXIMUM IN, body_length: 0.497 INCHES MINIMUM AND 0.513 INCHES MAXIMUM IN, special_features: THICKNESS 300-MIL, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: PLASTIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-479-7904, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| body_height | 0.098 INCHES MINIMUM AND 0.105 INCHES MAXIMUM IN |
| body_length | 0.497 INCHES MINIMUM AND 0.513 INCHES MAXIMUM IN |
| special_features | THICKNESS 300-MIL |
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | STV CAMERA SY |
| inclosure_configuration | LEADED CHIP CARRIER |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-479-7904 |
| INCLOSURE MATERIAL | PLASTIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER AND 1 DRIVER, LINE |
| BODY WIDTH | 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.098 INCHES MINIMUM AND 0.105 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| BODY LENGTH | 0.497 INCHES MINIMUM AND 0.513 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| SPECIAL FEATURES | THICKNESS 300-MIL |