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CW304W — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

CW304W: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-039-3440, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
CW304W
NSN: 5962-01-039-3440
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 200.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationCONVERTER MODEL 6514A FSCM 35351 A
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-039-3440
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN CW304W MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 6 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: ROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: -0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN6 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
BODY HEIGHT0.040 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATOR-0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 200.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 5
S8224WReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 004Reference document
Same NSN cross-reference
Reference document — Secondary reference
9034FMReference document
Same NSN cross-reference
Reference document — Secondary reference
HL40390Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
CC184WReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is CW304W?
CW304W is a MICROCIRCUIT,MEMORY.
What parts can replace CW304W?
There are 5 known substitutes for CW304W: S8224W, ROM/PROM FAMILY 004, 9034FM and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for CW304W?
CW304W is cataloged in the U.S. Government catalog under NSN 5962-01-039-3440. This indicates validated use in U.S. government and defense supply chains.
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