The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: STEEL OVERALL, special_features: 1 TOP PLATE,1 BOTTOM PLATE;1 THD BOLT AND NUT;40 0.156 IN. DIA HOLES;10 0.250 IN.
DIA HOLES 2.875 IN. DIA,1.875 IN. H IN.
This product is currently in active production with full OEM support. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 4820-00-690-3790, indicating validated use in U.S. government and defense logistics supply chains.
Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | STEEL OVERALL |
| special_features | 1 TOP PLATE,1 BOTTOM PLATE;1 THD BOLT AND NUT;40 0.156 IN. DIA HOLES;10 0.250 IN. DIA HOLES 2.875 IN. DIA,1.875 IN. H IN |
| NSN | 4820-00-690-3790 |
| MATERIAL | STEEL OVERALL |
| SPECIAL FEATURES | 1 TOP PLATE,1 BOTTOM PLATE;1 THD BOLT AND NUT;40 0.156 IN. DIA HOLES;10 0.250 IN. DIA HOLES 2.875 IN. DIA,1.875 IN. H IN |