Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: CP258319-3

CP258319-3 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: EPROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-373-0566, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CP258319-3

NSN: 5962-01-373-0566
FSC: 5962
CAGE: 94987 — CUBIC DEFENSE APPLICATIONS, INC. (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND HIGH IMPEDANCE AND W/DISABLE AND W/ENABLE AND ULTRAVIOLET ERASABLE AND PROGRAMMED AND W/BUFFERED OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-373-0566

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS

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INPUT CIRCUIT PATTERN: 17 INPUT

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CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510

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CAPITANCE RATING PER CHARACTERISTIC: 6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM

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TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM ACCESS NS

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TERMINAL SURFACE TREATMENT: SOLDER

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TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
INPUT CIRCUIT PATTERN	17 INPUT
CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510
CAPITANCE RATING PER CHARACTERISTIC	6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM ACCESS NS
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	EPROM

VERIFIED SUBSTITUTES & CROSS-REFERENCES 11

M38510/22401BYXInterchangeable