CN-1431: INSULATING COMPOUND,ELECTRICAL.
The INSULATING COMPOUND,ELECTRICAL is a the manufacturer industrial component. Key specifications include physical_form: SYRINGE, special_features: USED AS UNDERFILL BETWEEN HIGH VOLTAGE COMPONENTS, BALL GRID ARRAYS, FLIP CHIPS, OR CHIP SCALE PACKAGES, part_name_assigned_by_controlling_agency: ENCAPSULANT, REWORKABLE UNDERFILL, dielectric_material_voltage_rating_per_mil_thickness_in_volts: 1000.0. This part is cataloged in the U.S.
Government catalog under NSN 5970-01-591-6869, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| physical_form | SYRINGE |
| special_features | USED AS UNDERFILL BETWEEN HIGH VOLTAGE COMPONENTS, BALL GRID ARRAYS, FLIP CHIPS, OR CHIP SCALE PACKAGES |
| part_name_assigned_by_controlling_agency | ENCAPSULANT, REWORKABLE UNDERFILL |
| dielectric_material_voltage_rating_per_mil_thickness_in_volts | 1000.0 |
| NSN | 5970-01-591-6869 |
| PHYSICAL FORM | SYRINGE |
| DIELECTRIC MATERIAL VOLTAGE RATING PER MIL THICKNESS IN VOLTS | 1000.0 |
| SPECIAL FEATURES | USED AS UNDERFILL BETWEEN HIGH VOLTAGE COMPONENTS, BALL GRID ARRAYS, FLIP CHIPS, OR CHIP SCALE PACKAGES |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | ENCAPSULANT, REWORKABLE UNDERFILL |