CLX-820185-000: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.148 INCHES MINIMUM AND 0.181 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND HYBRID, inclosure_material: METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, body_outside_diameter: 0.595 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-258-7469, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.148 INCHES MINIMUM AND 0.181 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND HYBRID |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.595 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | TIN |
| terminal_type_and_quantity | 12 PIN |
| design_function_and_quantity | 1 AMPLIFIER, BUFFER |
| maximum_power_dissipation_rating | 1.5 WATTS |
| NSN | 5962-01-258-7469 |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | TIN |
| BODY OUTSIDE DIAMETER | 0.595 INCHES MINIMUM AND 0.605 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, BUFFER |
| BODY HEIGHT | 0.148 INCHES MINIMUM AND 0.181 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HYBRID |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-8 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.