The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND HIGH VOLTAGE, inclosure_material: METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, body_outside_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-144-7546, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND HIGH VOLTAGE |
| inclosure_material | METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 8 PIN |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| maximum_power_dissipation_rating | 670.0 MILLIWATTS |
| NSN | 5962-01-144-7546 |
| INCLOSURE MATERIAL | METAL |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | CAN |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND HIGH VOLTAGE |