CIC200-3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CIC200-3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_height: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, special_features: 40 UV PER DEG C TEMP COEFFICIENT OF INPUT OFFSET VOLTAGE, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS, precious_material: GOLD, inclosure_material: GLASS AND METAL, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-331-7584, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CIC200-3

NSN: 5962-00-331-7584
FSC: 5962 — Microcircuits, Electronic
CAGE: 16067 — CALIFORNIA INSTRUMENTS CORP (USA)

SPECIFICATIONS

body_height	0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
special_features	40 UV PER DEG C TEMP COEFFICIENT OF INPUT OFFSET VOLTAGE
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
precious_material	GOLD
inclosure_material	GLASS AND METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
body_outside_diameter	0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN
input_circuit_pattern	4 INPUT
inclosure_configuration	CAN
terminal_surface_treatment	GOLD
NSN	5962-00-331-7584

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 4 INPUT

•

INCLOSURE MATERIAL: GLASS AND METAL

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: CAN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	4 INPUT
INCLOSURE MATERIAL	GLASS AND METAL
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY OUTSIDE DIAMETER	0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN
BODY HEIGHT	0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	CAN
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL

SUBSTITUTES & CROSS-REFERENCES 2

3-60006Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

C1C200-3Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is CIC200-3?

CIC200-3 is a MICROCIRCUIT,MEMORY.

What parts can replace CIC200-3?

There are 2 known substitutes for CIC200-3: 3-60006, C1C200-3. Substitute compatibility should be verified for your specific system.

What is the NSN for CIC200-3?

CIC200-3 is cataloged in the U.S. Government catalog under NSN 5962-00-331-7584. This indicates validated use in U.S. government and defense supply chains.

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