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CHO-BOND 1085 — PRIMER,ADHESIVE

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

CHO-BOND 1085: PRIMER,ADHESIVE.

The PRIMER,ADHESIVE is a the manufacturer industrial component. Key specifications include material: SILICONE, usage_design: FOR PROMOTING ADHESION OF CHO-BOND 1029 ROOM TEMPERATURE VULCANIZING SILICONE ADHESIVE, physical_form: LIQUID, special_features: STORE MATERIAL BELOW 25 DEG C OUT OF SUNLIGHT AND IN ORIGINAL UNOPENED CONTAINERS DEGC, supplementary_features: 1 PINT CAN, quantity_within_each_unit_package: 1.000 PINTS. This part is cataloged in the U.S.

Government catalog under NSN 8040-01-217-6236, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
CHO-BOND 1085
NSN: 8040-01-217-6236
FSC: 8040 — Adhesives
CAGE: 18565 — PARKER-HANNIFIN CORPORATION DBA PNEUTRONICS DIV CHOMERICS DIVISION (USA)
SPECIFICATIONS
materialSILICONE
usage_designFOR PROMOTING ADHESION OF CHO-BOND 1029 ROOM TEMPERATURE VULCANIZING SILICONE ADHESIVE
physical_formLIQUID
special_featuresSTORE MATERIAL BELOW 25 DEG C OUT OF SUNLIGHT AND IN ORIGINAL UNOPENED CONTAINERS DEGC
supplementary_features1 PINT CAN
quantity_within_each_unit_package1.000 PINTS
NSN8040-01-217-6236
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available PRIMER,ADHESIVE TITLE COMPONENT PN CHO-BOND 1085 MFR PRIMER,ADHESIVE
KEY FEATURES
•
SUPPLEMENTARY FEATURES: 1 PINT CAN
•
QUANTITY WITHIN EACH UNIT PACKAGE: 1.000 PINTS
•
PHYSICAL FORM: LIQUID
•
COLOR: CLEAR
•
MATERIAL: SILICONE
•
USAGE DESIGN: FOR PROMOTING ADHESION OF CHO-BOND 1029 ROOM TEMPERATURE VULCANIZING SILICONE ADHESIVE
TECHNICAL CHARACTERISTICS
SUPPLEMENTARY FEATURES1 PINT CAN
QUANTITY WITHIN EACH UNIT PACKAGE1.000 PINTS
PHYSICAL FORMLIQUID
COLORCLEAR
SPECIAL FEATURESSTORE MATERIAL BELOW 25 DEG C OUT OF SUNLIGHT AND IN ORIGINAL UNOPENED CONTAINERS DEGC
MATERIALSILICONE
USAGE DESIGNFOR PROMOTING ADHESION OF CHO-BOND 1029 ROOM TEMPERATURE VULCANIZING SILICONE ADHESIVE
SUBSTITUTES & CROSS-REFERENCES 3
50-01-1085-0000Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
L04618Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
GP111HJ1Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
HAZMAT per U.S. Government catalogShelf-life managedAcquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is CHO-BOND 1085?
CHO-BOND 1085 is a PRIMER,ADHESIVE.
What parts can replace CHO-BOND 1085?
There are 3 known substitutes for CHO-BOND 1085: 50-01-1085-0000, L04618, GP111HJ1. Substitute compatibility should be verified for your specific system.
What is the NSN for CHO-BOND 1085?
CHO-BOND 1085 is cataloged in the U.S. Government catalog under NSN 8040-01-217-6236. This indicates validated use in U.S. government and defense supply chains.
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