CH1209Q — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CH1209Q: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.660 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 1.330 INCHES MAXIMUM IN, overall_width: 1.400 INCHES MAXIMUM IN, overall_height: 0.100 INCHES MAXIMUM IN, overall_length: 1.330 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-238-7635, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CH1209Q

NSN: 5962-01-238-7635
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.660 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	1.330 INCHES MAXIMUM IN
overall_width	1.400 INCHES MAXIMUM IN
overall_height	0.100 INCHES MAXIMUM IN
overall_length	1.330 INCHES MAXIMUM IN
features_provided	BURN IN, MIL-STD-883, CLASS A AND PROGRAMMABLE AND W/CLOCK
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-238-7635

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.660 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.100 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.660 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
OVERALL LENGTH	1.330 INCHES MAXIMUM IN
OVERALL WIDTH	1.400 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN, MIL-STD-883, CLASS A AND PROGRAMMABLE AND W/CLOCK
INCLOSURE CONFIGURATION	FLAT PACK

SUBSTITUTES & CROSS-REFERENCES 2

CH1209Reference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 90117BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is CH1209Q?

CH1209Q is a MICROCIRCUIT,MEMORY.

What parts can replace CH1209Q?

There are 2 known substitutes for CH1209Q: CH1209, DMS 90117B. Substitute compatibility should be verified for your specific system.

What is the NSN for CH1209Q?

CH1209Q is cataloged in the U.S. Government catalog under NSN 5962-01-238-7635. This indicates validated use in U.S. government and defense supply chains.

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