The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 3.438 INCHES NOMINAL IN, body_height: 4.125 INCHES NOMINAL IN, body_length: 3.438 INCHES NOMINAL IN, cubic_measure: 48.7 CUBIC INCHES, rating_method: ELECTRICAL SINGLE COMPONENT SINGLE WINDING, inclosure_type: HERMETICALLY SEALED. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-402-9348, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 3.438 INCHES NOMINAL IN |
| body_height | 4.125 INCHES NOMINAL IN |
| body_length | 3.438 INCHES NOMINAL IN |
| cubic_measure | 48.7 CUBIC INCHES |
| rating_method | ELECTRICAL SINGLE COMPONENT SINGLE WINDING |
| inclosure_type | HERMETICALLY SEALED |
| inductance_type | FIXED |
| mounting_method | FLANGE AND UNTHREADED HOLE(S) SINGLE GROUP |
| winding_quantity | 1 SINGLE COMPONENT |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM SPEED AND POSITIVE OUTPUTS |
| inductance_rating | 10.00 HENRY NOMINAL SINGLE COMPONENT SINGLE WINDING |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| NSN | 5962-00-402-9348 |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-85 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 30.0 MILLIWATTS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM SPEED AND POSITIVE OUTPUTS |
| DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND |
| BODY WIDTH | 0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |