CDP1823BLH/3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CDP1823BLH/3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN, body_length: 0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN, features_provided: HIGH IMPEDANCE AND HERMETICALLY SEALED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-128-3916, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CDP1823BLH/3

NSN: 5962-01-128-3916
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN
body_height	0.055 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
body_length	0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN
features_provided	HIGH IMPEDANCE AND HERMETICALLY SEALED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
end_item_identification	DATA LINK 76301
terminal_surface_treatment	SOLDER
NSN	5962-01-128-3916

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.055 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HIGH IMPEDANCE AND HERMETICALLY SEALED

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN
BODY HEIGHT	0.055 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
FEATURES PROVIDED	HIGH IMPEDANCE AND HERMETICALLY SEALED
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.415 INCHES MINIMUM AND 0.430 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is CDP1823BLH/3?

CDP1823BLH/3 is a MICROCIRCUIT,MEMORY.

What is the NSN for CDP1823BLH/3?

CDP1823BLH/3 is cataloged in the U.S. Government catalog under NSN 5962-01-128-3916. This indicates validated use in U.S. government and defense supply chains.

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CDP1823BLH/3 — MICROCIRCUIT,MEMORY

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