CDP1802CD/3: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.520 INCHES MINIMUM AND 0.630 INCHES MAXIMUM IN, body_height: 0.225 INCHES MAXIMUM IN, body_length: 2.096 INCHES MAXIMUM IN, special_features: ELECTROSTATIC DISCHARGE SENSITIVE, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-128-9753, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.520 INCHES MINIMUM AND 0.630 INCHES MAXIMUM IN |
| body_height | 0.225 INCHES MAXIMUM IN |
| body_length | 2.096 INCHES MAXIMUM IN |
| special_features | ELECTROSTATIC DISCHARGE SENSITIVE |
| features_provided | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 18 INPUT |
| end_item_identification | B-1B |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-128-9753 |
| INPUT CIRCUIT PATTERN | 18 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CENTRAL PROCESSOR UNIT |
| BODY WIDTH | 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.130 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND LOW POWER AND W/CLOCK AND W/CLEAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |