CD54HC27F/3A — Technical Data Sheet

✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, special_features: ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE SUPPLY CENTER COLUMBUS PRODUCTION STANDARD LO3838, features_provided: HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-248-7305, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD54HC27F/3A

NSN: 5962-01-248-7305
FSC: 5962
CAGE: 18714 — HARRIS CORP FINDLAY OPNS (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	0.785 INCHES MAXIMUM IN
special_features	ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE SUPPLY CENTER COLUMBUS PRODUCTION STANDARD LO3838
features_provided	HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	3 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-248-7305

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

BODY LENGTH: 0.785 INCHES MAXIMUM IN

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TIME RATING PER CHACTERISTIC: 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC AND GLASS
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH	0.785 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING	500.0 MILLIWATTS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
DESIGN FUNCTION AND QUANTITY	3 GATE, NOR

VERIFIED SUBSTITUTES & CROSS-REFERENCES 18

84042Interchangeable