CD54HC138F: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-219-9876, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-219-9876 |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 DECODER, ONE OF EIGHT LINE |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HIGH SPEED AND LOW POWER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.750 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS DEGC |