CD4528BMW/883 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.283 INCHES MAXIMUM IN, body_height: 0.075 INCHES MAXIMUM IN, body_length: 0.409 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND RESETTABLE AND RETRIGGERABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-224-9662, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD4528BMW/883

NSN: 5962-01-224-9662
FSC: 5962
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.283 INCHES MAXIMUM IN
body_height	0.075 INCHES MAXIMUM IN
body_length	0.409 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND RESETTABLE AND RETRIGGERABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	DUAL 3 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-224-9662

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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BODY WIDTH: 0.283 INCHES MAXIMUM IN

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MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TERMINAL TYPE AND QUANTITY: 16 FLAT LEADS

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INCLOSURE CONFIGURATION: FLAT PACK

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FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND RESETTABLE AND RETRIGGERABLE

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH	0.283 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING	500.0 MILLIWATTS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	16 FLAT LEADS
INCLOSURE CONFIGURATION	FLAT PACK
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND RESETTABLE AND RETRIGGERABLE
BODY HEIGHT	0.075 INCHES MAXIMUM IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 20

MM74C10N/BPLUSInterchangeable