CD4520BD/3: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-028-2081, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.870 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 3 INPUT |
| end_item_identification | RECEIVER FSCM 50464 |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-028-2081 |
| INPUT CIRCUIT PATTERN | DUAL 3 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH VOLTAGE AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND W/CLEAR AND RESETTABLE AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |