The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.390 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-150-8198, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.390 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-150-8198 |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| BODY WIDTH | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-2 MIL-M-38510 |
| TEST DATA DOCUMENT | 86360-515C2030-03 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |
| TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |