CD4069MW/883C — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CD4069MW/883C: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.390 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BURN IN AND HERMETICALLY SEALED AND DYNAMIC AND POSITIVE OUTPUTS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-150-6772, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD4069MW/883C

NSN: 5962-01-150-6772
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	0.390 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BURN IN AND HERMETICALLY SEALED AND DYNAMIC AND POSITIVE OUTPUTS
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	HEX 1 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	14 FLAT LEADS
NSN	5962-01-150-6772

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: HEX 1 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 6 INVERTER

•

BODY WIDTH: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BURN IN AND HERMETICALLY SEALED AND DYNAMIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	HEX 1 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	6 INVERTER
BODY WIDTH	0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BURN IN AND HERMETICALLY SEALED AND DYNAMIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	F-2 MIL-M-38510
BODY LENGTH	0.390 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

M38510/17401BTCReference document

Same NSN cross-reference

Reference document — Secondary reference

515C5430-01-020Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

4069UBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is CD4069MW/883C?

CD4069MW/883C is a MICROCIRCUIT,DIGITAL.

What parts can replace CD4069MW/883C?

There are 3 known substitutes for CD4069MW/883C: M38510/17401BTC, 515C5430-01-020, 4069UB. Substitute compatibility should be verified for your specific system.

What is the NSN for CD4069MW/883C?

CD4069MW/883C is cataloged in the U.S. Government catalog under NSN 5962-01-150-6772. This indicates validated use in U.S. government and defense supply chains.

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