CD4049UBF/3W — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED, output_logic_form: COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-190-6956, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD4049UBF/3W

NSN: 5962-01-190-6956
FSC: 5962
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
body_length	0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_provided	BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED
output_logic_form	COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	HEX 1 INPUT
inclosure_configuration	DUAL-IN-LINE
design_function_and_quantity	6 BUFFER, INVERTING
NSN	5962-01-190-6956

COMPONENT DIAGRAM

KEY FEATURES

•

BODY LENGTH: 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN

•

INPUT CIRCUIT PATTERN: HEX 1 INPUT

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INCLOSURE MATERIAL: CERAMIC

•

DESIGN FUNCTION AND QUANTITY: 6 BUFFER, INVERTING

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC

TECHNICAL CHARACTERISTICS (FLIS)

BODY LENGTH	0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	HEX 1 INPUT
INCLOSURE MATERIAL	CERAMIC
DESIGN FUNCTION AND QUANTITY	6 BUFFER, INVERTING
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-OXIDIZED-SILICON LOGIC AND METAL OXIDE-SEMICONDUCTOR LOGIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY HEIGHT	0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 11

CD4049UBF/3Interchangeable