The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, end_item_identification: SDV MOD1 DS E/I FSCM 53711. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-459-3195, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -40.0 TO 85.0 CELSIUS DEGC |
| end_item_identification | SDV MOD1 DS E/I FSCM 53711 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 PRINTED CIRCUIT |
| design_function_and_quantity | 1 BUFFER, INVERTING |
| maximum_power_dissipation_rating | 700.0 MILLIWATTS |
| part_name_assigned_by_controlling_agency | HEX INVERTING BUFFER |
| NSN | 5962-01-459-3195 |
| MAXIMUM POWER DISSIPATION RATING | 700.0 MILLIWATTS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | HEX INVERTING BUFFER |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| END ITEM IDENTIFICATION | SDV MOD1 DS E/I FSCM 53711 |