The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 7.87 MILLIMETERS MAXIMUM MM, body_height: 5.08 MILLIMETERS MAXIMUM MM, body_length: 21.34 MILLIMETERS MAXIMUM MM, features_provided: MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-072-0924, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 7.87 MILLIMETERS MAXIMUM MM |
| body_height | 5.08 MILLIMETERS MAXIMUM MM |
| body_length | 21.34 MILLIMETERS MAXIMUM MM |
| features_provided | MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| specification/standard_data | 81349-MIL-M-38510/055 GOVERNMENT SPECIFICATION |
| design_function_and_quantity | 6 BUFFER, INVERTING |
| NSN | 5962-01-072-0924 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER, NONINVERTING |
| OUTPUT LOGIC FORM | COMPLEMENTARY-LOGIC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY WIDTH | 0.250 INCHES NOMINAL IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.118 INCHES NOMINAL IN |
| BODY LENGTH | 0.765 INCHES NOMINAL IN |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |