CD4034AF3: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.625 INCHES MAXIMUM IN, body_height: 0.250 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: BIDIRECTIONAL AND PARALLEL OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-114-5425, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.625 INCHES MAXIMUM IN |
| body_height | 0.250 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| features_provided | BIDIRECTIONAL AND PARALLEL OPERATION |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-114-5425 |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.070 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |