CD4029BMJ/883 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.120 INCHES NOMINAL IN, body_length: 0.896 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND PRESETTABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC OR METAL. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-00-214-3313, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD4029BMJ/883

NSN: 5962-00-214-3313
FSC: 5962
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.120 INCHES NOMINAL IN
body_length	0.896 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND PRESETTABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC OR METAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	5 INPUT
end_item_identification	F-15 ACFT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-00-214-3313

COMPONENT DIAGRAM

KEY FEATURES

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TERMINAL SURFACE TREATMENT: SOLDER

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FEATURES PROVIDED: POSITIVE OUTPUTS AND MONOLITHIC

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

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CASE OUTLINE SOURCE AND DESIGNATOR: -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL

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BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

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INCLOSURE MATERIAL: CERAMIC AND GLASS

TECHNICAL CHARACTERISTICS

TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	POSITIVE OUTPUTS AND MONOLITHIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	-0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
INCLOSURE MATERIAL	CERAMIC AND GLASS
BODY LENGTH	0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING	200.0 MILLIWATTS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

CD4029ADInterchangeableGOVERNMENT REGISTRY