CD4027BFA3/883 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

CD4027BFA3/883: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.740 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-198-8919, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

CD4027BFA3/883

NSN: 5962-01-198-8919
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.740 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	DUAL 5 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
design_function_and_quantity	2 FLIP-FLOP, J-K, CLOCKED
time_rating_per_chacteristic	200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
NSN	5962-01-198-8919

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: DUAL 5 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 2 FLIP-FLOP, J-K, CLOCKED

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BISTABLE AND BURN IN AND COMPATIBLE CMOS AND COMPLEMENTARY OUTPUTS AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HIGH RELIABILITY AND LOW POWER AND POSITIVE EDGE TRIGGERED AND POSITIVE OUTPUTS AND PRESETTABLE AND 2-STATE OUTPUT AND SYNCHRONOUS AND W/CLEAR AND W/BUFFERED OUTPUT AND W/CLOCK AND W/INDEPENDENT OUTPUTS AND W/PRESET

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	DUAL 5 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	2 FLIP-FLOP, J-K, CLOCKED
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	BISTABLE AND BURN IN AND COMPATIBLE CMOS AND COMPLEMENTARY OUTPUTS AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HIGH RELIABILITY AND LOW POWER AND POSITIVE EDGE TRIGGERED AND POSITIVE OUTPUTS AND PRESETTABLE AND 2-STATE OUTPUT AND SYNCHRONOUS AND W/CLEAR AND W/BUFFERED OUTPUT AND W/CLOCK AND W/INDEPENDENT OUTPUTS AND W/PRESET
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	0.740 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 6

MC14027BBEBSReference document

Same NSN cross-reference