The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.796 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-174-5542, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.796 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| special_test_features | TESTED PER BENDIX DWG 3322871 |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 1 GATE, AND |
| NSN | 5962-01-174-5542 |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, AND |