The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND W/COMMON CLEAR AND W/COMMON CLOCK, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-181-4864, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND W/COMMON CLEAR AND W/COMMON CLOCK |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 3 INPUT |
| end_item_identification | A/F-18-DCN |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-181-4864 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| END ITEM IDENTIFICATION | A/F-18-DCN |
| TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.795 INCHES MAXIMUM IN |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |