The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-102-8228, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| bit_quantity | 6 |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 6 CHANNEL AND DUAL 8 INPUT |
| end_item_identification | 1520-01-106-9519 AH64A HELICOPTER,ATTACK |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-102-8228 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | HEX 2 INPUT |
| FEATURES PROVIDED | POSITIVE EDGE TRIGGERED AND W/COMMON CLOCK |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-OXIDIZED-SILICON LOGIC |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 16 PIN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CASE OUTLINE SOURCE AND DESIGNATOR | MO-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |