The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HIGH RELIABILITY AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-169-4808, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND HIGH RELIABILITY AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| special_test_features | TESTED PER BASE TEN SYSTEMS DWG 23140 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-169-4808 |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY HEIGHT | 0.180 INCHES NOMINAL IN |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |
| SPECIAL TEST FEATURES | TESTED PER BASE TEN SYSTEMS DWG 23140 |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 6 FLIP-FLOP, D-TYPE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |