CC5193-862: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-123-6650, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN |
| body_height | 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND 3-STATE OUTPUT AND W/BUFFERED OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-123-6650 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND 3-STATE OUTPUT AND W/BUFFERED OUTPUT |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.440 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |