The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND 3-STATE OUTPUT AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-075-6867, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN |
| body_height | 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND 3-STATE OUTPUT AND BIPOLAR |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-075-6867 |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.440 INCHES MAXIMUM IN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| MEMORY CAPACITY | UNKNOWN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |